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Orion Industries Inc specializes in designing unique shielding laminates applying selective die cutting techniques for cost effective solutions. Orion has been awarded two patents for advanced design in shielding enclosures.
Unfortunately, plastics are virtually transparent to EMI and RFI signals. To shield against unwanted interference, a barrier of electrically conductive material is needed, many times with some sort of grounding mechanism. Most of our materials consist of a metal foil (usually, copper or aluminum) laminated to an insulating substrate, which prevents unwanted grounding of circuits. The insulator also adds structural integrity to the shield, since the foil is very thin (0.002”-0.005”). Typical designs may also incorporate areas where the insulator is removed for grounding.
Our material specialists will assist you in determining the most appropriate material for your application. The design considerations will most likely include:
Orion Industries has been producing shielding laminates for over twenty-five years.